Meet us at OFC 2026
March 9, 2026

logo [OFC]

NTT Innovative Devices Corporation is proud to announce its participation in OFC 2026, held at the Los Angeles Convention Center in Los Angeles, California.


We will showcase our latest components and technologies, highlighting the technological direction and development roadmap for Photonics-Electronics Convergence devices, as well as optical components for network applications. In addition, we will showcase NTT Inc.’s most recent R&D achievements on the next-generation Photonics-Electronics Convergence devices.


Highlight

1. Technology roadmap: Photonics-Electronics Convergence Devices

We will showcase our Photonics-Electronics Convergence devices and its technology roadmap at our booth. Photonics-Electronics Convergence is a core technology of IOWN.

2. 102.4T Open CPO Switch platform with socketed optical engines

We will present the newest production, 102.4T CPO Switch Box,
which enables significant power savings and supports a flexible module architecture.


photo of AFF

photo of PXL

We also showcase our latest product for core/metro networks and metro/access networks applications such as:

For Core / Metro Networks

  • 1.2Tbps Digital Coherent products: “ExaSPEED GAIA/GAIAex” coherent DSPs and Ultra High Bandwidth Coherent Driver Modulator (UHB-CDM)
  • 800G Digital Coherent products: “ExaSPEED 800” coherent DSP and “ExaLIGHT 800” co-packaged optics
  • 400G Digital Coherent products: “ExaSPEED 400/400-R” coherent DSP and Coherent Optical Sub-Assembly (COSA)
  • PLC components: multi band multicast switch and PLC type multi-core fiber FIFO (Fan In / Fan Out).

For Metro / Access Networks

  • PON and Ethernet optical components: 10Gbaud – 50Gbaud high-power EML (AXEL: SOA assisted eXtended reach EA-DFB Laser), high-sensitivity APD (Avalanche Photo Diode)
  • Ethernet optical components: 100Gbaud (200G/lane) EML (EA-DFB laser), pin-PD (pin type-Photo Diode)
  • PON electrical components: 10Gbaud, 25Gbaud high-sensitivity BM-TIA (Burst Mode TransImpedance Amplifier).
  • PLC chips: MUX/DEMUX filter and interposer for data communication transceivers.

We warmly invite you to visit our booth #629 and explore the latest updates on our cutting-edge products.

OFC 2026 Exhibition

Date:
17th-19th Mar., 2026
Venue:
Los Angeles Convention Center, Los Angeles, CA, United States
Website:
https://www.ofcconference.org/
Booth :
#629@South Hall

News

Go to top of the page